Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip
AssigneeOSRAM Opto Semiconductors GmbH
InventorsAndreas Ploessl, Stefan Illek, Vincent Grolier
Life of this patent
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Abstract
A semiconductor chip (1), to which a layer sequence (2) intended for the production of a soldered connection has been applied. The layer sequence (2) comprises a solder layer (15) and an oxidation prevention layer (17), which follows the solder layer (15) as seen from the semiconductor chip (1). A barrier layer (16) is included between the solder layer (15) and the oxidation prevention layer (17). This prevents a constituent of the solder layer (15) from diffusing through the oxidation prevention layer (17) prior to the soldering operation, where it would effect oxidation that is disadvantageous for producing a soldered connection.
Claims29
A semiconductor chip having a layer sequence, which is intended to produce a soldered connection and comprises a solder layer and an oxidation prevention layer, which follows the solder layer as seen from the semiconductor chip, wherein a barrier layer is included between the solder layer and the oxidation prevention layer.
A process for forming a soldered connection between a carrier and a semiconductor chip, the carrier or the semiconductor chip being provided with a layer sequence intended to produce the soldered connection, wherein the layer sequence comprises a solder layer and an oxidation prevention layer, which follows the solder layer as seen in a growth direction of the layer sequence, a barrier layer being included between the solder layer and the oxidation prevention layer, and during the soldering operation the solder layer melting and the barrier layer and the oxidation prevention layer mixing with the solder layer.
Dependencies are inferred from the claim text.