Electronic component and method for its production

A method for producing a semiconductor wafer with semiconductor dies for electronic components, the method comprising:

• providing a semiconductor wafer, arranged in rows and columns, with semiconductor die positions,
• creating an active surface area in the semiconductor die positions on an active top side of the semiconductor wafer and applying contact connecting areas outside the active surface area,
• applying and patterning a sacrificial layer which comprises insulation material, on the active surface area, leaving through openings in the sacrificial layer exposed in the edge areas of the active surface area,
• applying a conductive material to the sacrificial layer and into the through openings for forming a cover layer with through lines,
• removing the sacrificial layer by forming a self-supporting cover layer, supported by through lines, above a hollow space above the active surface area,
• applying and patterning a first plastic layer on the cover layer and on the active top side, leaving the contact connecting areas exposed and sealing side edges of the hollow space above the active surface area,
• applying external contacts to the contact connecting areas, and
• splitting the semiconductor wafer into individual electronic components.