Method for making cable with a conductive bump array, and method for connecting the cable to a task object
AssigneeMutual-Pak Technology Co., Ltd.
InventorLu-Chen Hwan
Life of this patent
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Abstract
A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
Claims10
A method for making a cable, the method comprising:
- forming multiple conductive circuits on a surface of a cable substrate;
- coating a photoresist layer over the multiple conductive circuits, wherein multiple openings are formed on the photoresist layer, and some of the openings overlap on the conductive circuits;
- forming conductive bumps at the openings that overlap the conductive circuits so that the conductive bumps protrude from surfaces of the conductive circuits;
- removing the photoresist layer from the cable substrate;
- and
- coating a protective layer on the conductive bumps.
A cable with conductive bumps comprising a cable substrate formed with multiple circuits at one surface, and multiple conductive bumps formed on and protruded from the multiple circuits.
A method for connecting a cable having conductive bumps to a task object with conductive terminals, the method comprising:
- contacting the conductive bumps on the cable to the conductive terminals of the task object;
- and
- applying non-conductive paste between the cable and the task object to securely join the conductive bumps and the conductive terminals together.
Dependencies are inferred from the claim text.