Semiconductor device and method for manufacturing the same
AssigneeOki Electric Industry Co., Ltd.
InventorKouichi TANI
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Abstract
A method for manufacturing a semiconductor device in which a plurality of wiring layers are formed includes the steps of (a) preparing a semiconductor device on which a plurality of semiconductor elements are formed on one surface thereof, (b) forming a spiral inductor on the semiconductor substrate astride three or more wiring layers, and (c) forming a circuit wiring other than the spiral inductor in the wiring layer. The step of forming the spiral inductor and the step of forming the circuit wiring are performed simultaneously.
Claims20
A method for manufacturing a semiconductor device in which a plurality of wiring layers are formed, comprising the steps of:
- preparing a semiconductor device on which a plurality of semiconductor elements are formed on one surface thereof;
- forming a spiral inductor on the semiconductor substrate astride three or more wiring layers;
- and
- forming a circuit wiring other than the spiral inductor in the plurality of wiring layers;
- wherein the step of forming the spiral inductor and the step of forming the circuit wiring are performed simultaneously.
Dependencies are inferred from the claim text.