Semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsKeisuke Yonehama, Seiichi Mori, Eiji Sakagami, Masahisa Sonoda
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AssigneeKabushiki Kaisha Toshiba
InventorsKeisuke Yonehama, Seiichi Mori, Eiji Sakagami, Masahisa Sonoda
Estimating the term…
A semiconductor device includes an element isolation insulating film, memory cell transistors formed in an element isolation region and having respective gate electrodes, and a stopper film for forming a contact, formed both on a sidewall of the gate electrode of each transistor and on the element isolation insulating film between the gate electrodes. A level difference is set between the upper surface of the element isolation insulating film and the upper surface of the semiconductor substrate in the element isolation region. The level difference is set so that a level difference between the gate electrodes is smaller than a level difference in the gate electrode. Furthermore, the surface of the semiconductor substrate in the drain contact formation region is located lower than the surface of the semiconductor substrate corresponding to the gate electrode.
A semiconductor device comprising:
A method of manufacturing a semiconductor device, comprising the steps of:
Dependencies are inferred from the claim text.