Recessed-type field effect transistor with reduced body effect

Abstract

For fabricating a field effect transistor, an extra-doped channel region is formed below a surface of a semiconductor substrate. An opening is formed in the semiconductor substrate into the extra-doped channel region. A gate insulator is formed at walls of the opening such that the extra-doped channel region abuts the gate insulator at a bottom portion of the opening. The opening is filled with a gate electrode. Such an extra-doped channel region prevents undesired body effect in the field effect transistor.

Dependencies are inferred from the claim text.