Underfill dispense at substrate aperture
OwnerCharles Odegard, Marvin Cowens +1inventors
InventorsCharles Odegard, Marvin Cowens, Leon Stiborek
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Abstract
Disclosed are methods for dispensing underfill material in an IC assembly having a die mounted on a substrate with a gap therebetween. One or more aperture is provided in the substrate for receiving underfill material into the gap. Underfill material is dispensed into the gap through the one or more apertures, thereby filling the gap with underfill material and providing a favorable flow rate and improved underfilling. Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive pressure, are used to assist in the flow of the underfill material.
Claims11
A method for dispensing underfill material in an IC assembly having a die mounted on a substrate with a gap therebetween, comprising the steps of:
- providing an aperture in the substrate for receiving underfill material into the gap;
- dispensing underfill material into the gap through the aperture, thereby filling the gap with underfill material.
A method for dispensing underfill material in an IC assembly having a die mounted on a substrate with a gap therebetween, comprising the steps of:
- providing a plurality of apertures in the substrate for receiving underfill material into the gap;
- dispensing underfill material into the gap through at least two of the apertures, thereby filling the gap with underfill material.
Dependencies are inferred from the claim text.