Leadframe with encapsulant guide and method for the fabrication thereof

A method for fabricating a leadframe with encapsulant guide, comprising:

• forming a die attach paddle;
• forming leads around the periphery of the die attach paddle;
• forming encapsulant guides integral with and angled on the tips of a plurality of the leads to push the leads outwardly when an encapsulant flows therepast;
• attaching a semiconductor device to the die attach paddle;
• connecting lead wires between the semiconductor device and at least some of the leads;
• and
• encapsulating at least portions of the die attach paddle, semiconductor device, lead wires, and leads.

A leadframe with encapsulant guide, comprising:

• a die attach paddle;
• leads around at least portions of the die attach paddle;
• and
• encapsulant guides angled on a plurality of the leads for pushing the leads outwardly when an encapsulant flows therepast.

A leadframe with encapsulant guide, comprising:

• a die attach paddle;
• leads around the periphery of the die attach paddle;
• encapsulant guides integral with and angled on the tips of a plurality of the leads for pushing the leads outwardly when an encapsulant flows therepast;
• a semiconductor device attached to the die attach paddle;
• lead wires connected between the semiconductor device and at least some of the leads;
• and
• an encapsulant encapsulating at least portions of the die attach paddle, semiconductor device, lead wires, and leads.