Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers

A microelectronic imager assembly, comprising:

• an imager workpiece having a plurality of imager dies arranged in a die pattern, wherein individual imager dies include an image sensor and an integrated circuit operatively coupled to the imager sensor;
• an optically transmissive cover substrate;
• and
• a spacer having an integral web with a first side adhered to the imager workpiece, a second side spaced apart from the first side by a prefabricated separation distance and adhered to the cover substrate, and openings arranged in the die pattern and aligned with corresponding image sensors, wherein the web includes a material in a cured and non-flowable state before the imager workpiece and the cover substrate are both adhered to the spacer.

A microelectronic imager assembly, comprising:

• an imager workpiece having a plurality of imager dies arranged in a die pattern, wherein individual imager dies include an imager sensor and an integrated circuit operatively coupled to the image sensor;
• a cover substrate transmissive to radiation in an operating spectrum of the image sensors;
• and
• a prefabricated spacer having a web including a plurality of cut-edged openings arranged in the die pattern and aligned with the image sensors, a first side adhered to the imager workpiece, a second side adhered to the cover substrate, and a thickness that spaces the image sensors apart from the cover substrate by a desired distance.