Loading patent…
AssigneeHitachi, Ltd.
InventorsTakehide Yokozuka, Masahide Harada, Shiro Yamashita, Kaoru Uchiyama, Shuji Eguchi, Masahiko Asano, Koji Sato
Estimating the term…
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a mother board is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
An electronic device having a structure in which a metal core interposer substrate is joined to a metal base material or metal core base material motherboard with solder, the electronic device characterized in that:
(canceled)
An electronic device in which a metal core base material is mounted as an interposer substrate on a motherboard, the electronic device characterized in that:
The electronic device according to claim characterized in that:
An electronic device having a LSI, an interposer substrate having a structure in which a metal core substrate which an insulating layer and a wiring layer are formed on a front and back of a core metal, and a motherboard having a structure in which a metal base substrate which an insulating layer and a wiring layer are formed on a front of a metal core substrate and a base metal, the electronic device characterized in that:
An electronic device having a structure in which a case and a metal core interposer substrate is connected to a metal base substrate or a metal core substrate motherboard with solder, the electronic device characterized in that:
Dependencies are inferred from the claim text.