Semiconductor device with self-aligning contactless interface
OwnerScott Bestinventor
Life of this patent
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Abstract
Contactless interconnects between an integrated circuit die and an electrical structure are aligned by charging alignment pads on the integrated circuit die to a first voltage, and charging counterpart alignment pads on the electrical structure to a second voltage. The integrated circuit die is disposed in an initial position relative to the electrical structure to develop an electrostatic aligning force between the charged alignment pads and their counterparts. When the integrated circuit die and electrical structure are enabled to move relative to one another, the electrostatic aligning force shifts the relative positioning of the integrated circuit die and electrical structure toward a desired alignment.
Claims40
A method of aligning an integrated circuit die to an electrical structure, the method comprising:
- charging a plurality of alignment pads on the integrated circuit die to a first voltage;
- charging a plurality of counterpart alignment pads on the electrical structure to a second voltage;
- disposing the integrated circuit die in an initial position relative to the electrical structure to develop an electrostatic aligning force between the plurality of alignment pads and the plurality of counterpart alignment pads;
- and
- enabling relative movement between the integrated circuit die and the electrical structure in response to the electrostatic aligning force.
An integrated circuit device comprising:
- a semiconductor layer;
- a conductive structure coupled to the semiconductor layer;
- a first insulating layer disposed on the conductive structure;
- and
- a plurality of electrostatic alignment pads disposed on, and electrically isolated from the semiconductor layer by, the first insulating layer.
An integrated circuit package comprising:
- a first integrated circuit die having a semiconductor layer and a first plurality of alignment pads that are electrically isolated from the semiconductor layer;
- and
- an electrical structure disposed adjacent the first integrated circuit die and having a second plurality of alignment pads each aligned face-to-face with a counterpart one of the first plurality of alignment pads.
An integrated circuit device comprising a plurality of alignment pads to enable electrostatically-forced alignment with an electrical structure having a plurality of counterpart alignment pads, wherein the plurality of alignment pads is disposed in a predetermined pattern selected, at least in part, to reduce the possibility of electrostatically-forced misalignment between the integrated circuit device and the electrical structure.
An integrated circuit device comprising:
- a plurality of contactless interconnect structures;
- and
- a plurality of alignment structures to enable electrostatically-forced alignment with an electrical structure having a counterpart plurality of alignment structures and a counterpart plurality of contactless interconnect structures.
Computer readable media having information embodied therein that includes a description of an apparatus, the information including descriptions of:
- a plurality of contactless interconnect structures within an integrated circuit die;
- and
- a plurality of alignment structures within the integrated circuit die to enable electrostatically-forced alignment between the integrated circuit die and an electrical structure having a counterpart plurality of alignment structures and a counterpart plurality of contactless interconnect structures
An integrated circuit package comprising:
- an electrical structure;
- and
- an integrated circuit die having means for electrostatically forcing a desired alignment between the integrated circuit die and the electrical structure.
Dependencies are inferred from the claim text.