Method for predicting and optimizing chip performance in cured thermoset coatings
AssigneeBASF SE
InventorsTimothy December, Marc Fenwick, JoAnn Lanza, Yoshiko Kobayashi-San, Ippei Shinohara, Scott Kubish
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AssigneeBASF SE
InventorsTimothy December, Marc Fenwick, JoAnn Lanza, Yoshiko Kobayashi-San, Ippei Shinohara, Scott Kubish
Estimating the term…
Disclosed is a method for evaluating chip performance of a cured coating system. In one embodiment, the method includes providing a coated substrate comprising a substrate and a cured film of a first coating composition thereon, measuring elastic work energy (We/Wtot) of the cured film, and calculating a % C.P. of the cured film via the formula: % C.P.=7.61636−0.225473 (We/Wtot) wherein a % C.P. of equal to or less than about 3.5% correlates to a total paint loss of equal to or less than 5% of a coating system comprising the first coating composition. The disclosed method predicts the gravelometer chip performance of a cured multilayer coating system comprising a first coating composition and a topcoat by measuring the measuring elastic work energy (We/Wtot) of the cured first coating system alone. In one embodiment, chip performance can be predicted without topcoat application and independent of topcoat composition.
A nested transimpedance amplifier (TIA) circuit, comprising:
A nested transimpedance amplifier (TIA) circuit, comprising:
A nested transimpedance amplifier (TIA) circuit, comprising:
A nested differential mode TIA circuit, comprising:
A nested differential mode TIA circuit, comprising:
A nested differential mode TIA circuit, comprising:
A nested transimpedance amplifier (TIA) circuit, comprising:
A nested differential mode TIA circuit, comprising:
Dependencies are inferred from the claim text.