Photosensitive epoxy resin adhesive composition and use thereof
AssigneeNitto Denko Corporation
InventorMiho Yamaguchi
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Abstract
A photosensitive epoxy resin adhesive composition which is capable of forming a pattern by exposure to light through a photomask and development, and which, even after having formed a pattern in that manner, may still exhibit high adhesiveness when heated while keeping its pattern as such, as well as a photosensitive adhesive film which comprises the photosensitive epoxy resin adhesive composition. The photosensitive epoxy resin adhesive composition comprises an epoxy resin and a photo-acid generator, wherein the epoxy resin comprises a polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.
Claims7
A photosensitive epoxy resin adhesive composition comprising an epoxy resin and an photo-acid generator, wherein the epoxy resin comprises a first polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a second polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.
Dependencies are inferred from the claim text.