Ceramic glaze coating structure of a chip element and method of forming the same

A method of forming a ceramic glaze coating of a ceramic laminated chip element, comprising the following steps:

• selecting an appropriate conductive composition;
• selecting an appropriate first glaze;
• and
• conducting a sintering reaction using the conductive composition with the first glaze to selectively remove a ceramic glaze on any part of the chip element.

A method of forming a ceramic glaze coating of a ceramic laminated chip element, comprising the following steps:

• forming an electronic element body with a material body and inner electrodes;
• applying a ceramic glaze to the electronic element body;
• forming a plurality of terminal electrodes on the electronic element body coated with the ceramic glaze;
• conducting a sintering reaction using a conductive composition with a first glaze to selectively remove the ceramic glaze on the chip element;
• and
• forming a plurality of welding interface layers on the terminal electrodes respectively.

A method of forming a ceramic glaze coating of a ceramic laminated chip element, comprising the following steps:

• forming an electronic element body with a material body and inner electrodes;
• forming a plurality of terminal electrodes on the electronic element body;
• applying a ceramic glaze to the electronic element body having the plurality of terminal electrodes;
• conducting a sintering reaction using a conductive composition with a first glaze to selectively remove the ceramic glaze on the chip element;
• and
• forming a plurality of welding interface layers on the terminal electrodes respectively.

A method of forming a ceramic glaze coating of a ceramic laminated chip element, comprising the following steps:

• forming an electronic element body having a material body and inner electrodes;
• coating the electronic element body with a first ceramic glaze;
• forming a plurality of terminal electrodes on the electronic element body coated with the ceramic glaze;
• coating the electronic element body with a second ceramic glaze;
• using a sintering reaction between a conductive composition and a first glaze to selectively remove the first and second ceramic glazes on the chip element;
• and
• forming a plurality of welding-interface layers on the terminal electrodes respectively.