Method of treating inorganic oxide film, electronic device substrate, method of manufacturing electronic device substrate, liquid crystal panel, and electronic apparatus

A method of treating an inorganic oxide film comprising:

• bringing a first treatment liquid containing at least a primary alcohol into contact with an obliquely formed inorganic oxide film having a plurality of pores therein;
• chemically bonding the alcohol of the first treatment liquid to a surface of the inorganic oxide film;
• dipping the inorganic oxide film into a second treatment liquid containing at least a secondary alcohol having a lower molecular weight than that of the primary alcohol;
• infiltrating the second treatment liquid into the pores of the inorganic oxide film by reducing a pressure of a space where the second treatment liquid is provided;
• and
• chemically bonding the secondary alcohol of the second treatment liquid to the surface of the inorganic oxide film and inner surfaces of the pores.

An electronic device substrate comprising:

• a substrate;
• and
• an alignment film formed on a surface of the substrate,
• wherein the alignment film includes an obliquely formed inorganic oxide film that includes at least a primary alcohol and a secondary alcohol that is chemically bonded to a surface thereof that includes a plurality of pores therein and to an inner surface of each of the pores, the secondary alcohol having a lower molecular weight than that of the primary alcohol.

A method of manufacturing an electronic device substrate including a substrate and an alignment film formed on a surface of the substrate, comprising:

• forming an inorganic oxide film having a plurality of pores formed therein on the surface of the substrate by an oblique deposition method;
• dipping the substrate having the inorganic oxide film formed thereon into a treatment liquid containing at least a primary alcohol and a secondary alcohol, the secondary alcohol having a lower molecular weight than that of the primary alcohol;
• infiltrating the treatment liquid into the pores of the inorganic oxide film by reducing a pressure of a space where the treatment liquid is provided;
• and
• chemically bonding the alcohols of the treatment liquid to a surface of the inorganic oxide film and inner surfaces of the pores to form the alignment film.

A method of manufacturing an electronic device substrate including a substrate and an alignment film formed on a surface of the substrate, comprising:

• forming an inorganic oxide film having a plurality of pores formed therein on the surface of the substrate by an oblique deposition method;
• bringing a first treatment liquid containing at least a primary alcohol into contact with the inorganic oxide film;
• chemically bonding the primary alcohol of the first treatment liquid to a surface of the inorganic oxide film;
• dipping the substrate having the inorganic oxide film formed thereon into a second treatment liquid containing at least a secondary alcohol, the secondary alcohol having a lower molecular weight than that of the primary alcohol;
• infiltrating the second treatment liquid into the pores of the inorganic oxide film by reducing a pressure of a space where the second treatment liquid is provided;
• and
• chemically bonding at least the secondary alcohol of the second treatment liquid to the surface of the inorganic oxide film and inner surfaces of the pores to form the alignment film.