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US 2006/0233959 A1Published application
Application of film adhesive for post mold application
OwnerBarbara Stricklandinventor
Life of this patent
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Abstract
The method of preparing a sole assembly intended to be attached to a shoe upper and/or midsole. A coat of primer is applied to a molded shoe sole and then conditioned. A film adhesive is pressed on to the primer coated surface of the sole under pressure. The primer may be dried before applying the adhesive film. The sole is conditioned at 40-90° C. for approximately 30-60 seconds and heat pressed at 40-90° C. at 40-70 psi for 5-30 seconds.
Claims6
The method of preparing a sole assembly intended to be attached to a shoe upper and/or midsole, said method comprising:
- providing a molded shoe sole;
- applying a coat of primer on one surface of the shoe sole and conditioning the coated sole;
- pressing a film adhesive on to the primer coated surface of the sole under pressure.
Dependencies are inferred from the claim text.