Mounting device for heat dissipating apparatus
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsJie Zhang, Ching-Bai Hwang
Life of this patent
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Abstract
A mounting device for mounting a first element onto a second element includes a plurality of fastening elements; each of the fastening elements includes a connecting member defining a clasping groove therein, and a guiding portion adjacent to the clasping groove; a ring-shaped clipping member snaps in the clasping groove of the connecting member after moving over the guiding portion to be expanded; a fixing member is coupled to the connecting member for sandwiching the first element and the second element therebetween; a resilient member adapts for sandwiching between the connecting member and the first element to providing resilient force to urge the first element toward the second element.
Claims20
A mounting device for mounting a first element onto a second element, comprising a plurality of fastening elements, each of the fastening elements comprising:
- a connecting member defining a clasping groove therein, and a guiding portion adjacent to the clasping groove;
- a ring-shaped clipping member snapping in the clasping groove of the connecting member after moving over the guiding portion to be expanded;
- a fixing member coupled to the connecting member adapted for sandwiching the first element and the second element therebetween;
- and
- a resilient member adapted for being sandwiched between the connecting member and the first element for providing resilient force to urge the first element toward the second element.
A heat dissipating apparatus comprising:
- a circuit board with a heat generating electronic component mounted thereon;
- a thermal module contacting with the electronic component for dissipating heat generated by the electronic component;
- and
- a mounting device fastening the thermal module to the circuit board together, the mounting device comprising:
- a plurality of connecting members mounted to the thermal module, each connecting member comprising a main portion defining a clasping groove therein, a fixing portion extending from a bottom end of the main portion, a guiding portion between the clasping groove and the fixing portion, and a head portion disposed at a top end of the main portion;
- a plurality of resilient members compressed between the head portions and the thermal module;
- a plurality of clipping members snapped in the clasping grooves after moving over the guiding portions to be expanded;
- and
- a plurality of fixing members attached to the circuit board and coupled to the fixing portions thereby fastening the fixing portions of the connecting members to the circuit board.
An assembly comprising:
- a thermal module adapted for cooling a heat-generating electronic component mounted on a circuit board;
- a plurality of connecting members mounted to the thermal module, each connecting member having a top head, a bottom end, a groove between the top head and the bottom end and a guiding portion between the groove and the bottom end, the guiding member having a diameter larger than that of the bottom end and a circumferential surface tapering toward the bottom end, the bottom end being adapted for fastening with the circuit board;
- a plurality of resilient members each being compressed between the thermal module and the top head of a corresponding connecting member;
- and
- a plurality of ring-shaped clipping members each snapping in the groove of a corresponding connecting member, wherein the clipping members move over the guiding portions from the bottom ends of the connecting members before snapping into the grooves, respectively.
Dependencies are inferred from the claim text.