Heat sink and the method for making the same

Abstract

A heat sink includes multiple heat dissipating fins securely connected to each other and each heat dissipating fin having a board, a through hole defined through the board, a receiving space formed on an attachment on a side face of the board to communicate with the through hole, an adhesive heat conductive agent received in the receiving space and a heat conductive tube extending through aligned through holes of the heat dissipating fins, the adhesive heat conductive agent is so arranged in the receiving space that the adhesive heat conductive agent covers an outer periphery of the heat conductive tube and fills a gap between the heat conductive tube and the heat dissipating fins, thus engagement between the heat conductive tube and the heat dissipating fins is secured after the adhesive heat conductive agent has cooled and hardened.

Dependencies are inferred from the claim text.