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US 2006/0232939 A1Published application
Coolant cooled type semiconductor device
AssigneeDenso Corporation
InventorSeiji Inoue
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a cooling unit in which coolant flows, a semiconductor chip having two main surfaces press-pinched by the cooling unit, and an electronic member different from the semiconductor chip. The electronic member is located to contact the cooling unit.
Claims5
A semiconductor device comprising:
- a cooling unit in which coolant flows;
- a semiconductor chip having two main surfaces press-pinched by the cooling unit;
- and
- an electronic member different from the semiconductor chip,
- wherein the electronic member is located to contact the cooling unit.
2 more elements
Dependencies are inferred from the claim text.