Back to results
US 2006/0232932 A1Published application
Heatsink for electronic heat generating components
AssigneeHewlett-Packard Development Company, L.P.
InventorsRobert Curtis, Roy Zeighami, Christian Belady, Brent Boudreaux
Life of this patent
Estimating the term…
Abstract
Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.
Claims20
1) A heatsink, comprising:
- a metal base having a plurality of grooves;
- and
- a plurality of graphite fins connected to the base for thermally dissipating heat from the base and into a surrounding environment, wherein the fins are secured within the grooves with an interference fit produced by thermally expanding the base.
8) A heatsink, comprising:
- a metal base having plural grooves formed on an outer surface;
- and
- plural graphite fins extending from the base for dissipating heat from the heatsink, the grooves being thermally expanded to receive the fins and then cooled to provide a secure attachment between the fins and the base.
16) A method, comprising:
- heating a base to expand a plurality of grooves;
- inserting a plurality of fins into the grooves while the base is heated, the base and fins forming a heatsink;
- and
- connecting the heatsink to an electronic heat generating component to dissipate heat away from the heat generating component.
1 more element
Dependencies are inferred from the claim text.