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US 2006/0232928 A1Published application
Heat sink for multiple components
OwnerWade Vinson, Thomas Hardt +1inventors
InventorsWade Vinson, Thomas Hardt, Thomas Bumby
Life of this patent
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Abstract
In accordance with certain embodiments, a computer system having multiple electronic components, and a heat sink having cantilever portions disposed against the multiple electronic components.
Claims20
A computer system, comprising:
- first and second electronic components;
- and
- a cantilevered heat sink comprising:
- a first cantilever portion having a first contact surface disposed against the first electronic component;
- and
- a second cantilever portion having a second contact surface disposed against the second electronic component.
3 more elements
(canceled)
A heat sink for a computer, comprising:
- a thermally conductive member having first and second cantilever portions coupled to a base portion, wherein the first and second cantilever portions are configured to contact surfaces of first and second electronic components, respectively and wherein the contact surfaces of the first and second electronic components are at differing heights.
A method of operating an electronic device, comprising:
- conducting heat from first and second electronic components through a thermally conductive member comprising first and second cantilever portions disposed on the first and second electronic components, wherein the thermally conductive plate comprises a lateral portion extending from the first and second cantilever portions;
- and
- convecting heat from the thermally conductive member via convective members.
(canceled)
Dependencies are inferred from the claim text.