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AssigneeFerro Corporation
InventorsMohammed Megherhi, Mike Chu, Daniel McCauley, Elisabeth Romer, Willibrordus Coppens, Knuth Albertsen
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Multilayer ceramic chip capacitors which satisfy Y5V requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel, copper, and alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise BaTiO3 doped with other metal oxides such as MgO, CaO, ZnO, MnO2, ZrO2, SiO2, Nd2O3, Nb2O5, and Y2O3.
A method of forming an electronic component comprising:
A method of forming an electronic component comprising:
A method of forming an electronic component comprising:
A method of forming an electronic component comprising:
A multilayer ceramic chip capacitor comprising alternately stacked layers of a dielectric material and an internal electrode material comprising a transition metal other than Ag, Au, Pd, or Pt, the dielectric material comprising a sintered blend of
A multilayer ceramic chip capacitor comprising a dielectric material having the formula
Dependencies are inferred from the claim text.