Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

A system for inspecting a semiconductor wafer, comprising:

• an inspection illuminator configured to direct light energy toward the semiconductor wafer;
• a damping element mounted in relatively close proximity to said semiconductor wafer, said damping element and said semiconductor wafer being spaced apart by a gap free of components;
• and
• an inspection sensor configured to receive reflected light energy from the semiconductor wafer.

A method for inspecting both sides of a semiconductor wafer, comprising:

• mounting a substantially rigid element proximate the semiconductor wafer, thereby forming a gap between said substantially rigid element, wherein the substantially rigid element spaced apart from the semiconductor wafer by the gap causes damping of the semiconductor wafer;
• directing light energy toward the semiconductor wafer;
• and
• receiving light energy reflected from the semiconductor wafer.

A method for inspecting a semiconductor wafer, comprising:

• positioning a substantially rigid damping member proximate the semiconductor wafer, thereby forming a gap of space between the substantially rigid damping member and the semiconductor wafer;
• emitting light energy toward the semiconductor wafer;
• and
• receiving light energy reflected from the semiconductor wafer to inspect the semiconductor wafer.