Inlet for an electronic tag
AssigneeRenesas Technology Corp.
InventorsMichio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
Life of this patent
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Abstract
Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.
Claims23
1-18. (canceled)
An inlet for an electronic tag comprising:
- an insulating film;
- an antenna element made of a conductor layer formed over one surface of the insulating film;
- a slit formed in a portion of the antenna element and having a portion disposed between a first lateral edge of the antenna element and a second lateral edge of the antenna element opposite to the first lateral edge;
- a semiconductor chip electrically connected to the antenna element via a plurality of bump electrodes at a predetermined lengthwise portion of the slit;
- and
- a resin sealing the semiconductor chip and the plurality of bump electrodes;
- wherein the plurality of bump electrodes are electrically connected to a plurality of leads integral with the antenna element, respectively;
- and
- wherein each of the plurality of leads extends along a direction perpendicular to a long side direction of the antenna element.
An inlet for an electronic tag according to claim 1, wherein a cover film for protecting the antenna element and the semiconductor chip is stacked over the one surface of the insulating film.
An inlet for an electronic tag comprising:
- an insulating film;
- an antenna element made of a conductor layer formed over one surface of the insulating film;
- a slit formed in a portion of the antenna element and having a portion extending along a lengthwise direction of the antenna element and disposed between a first lateral edge of the antenna element and a second lateral edge of the antenna element opposite to the first lateral edge;
- a semiconductor chip electrically connected to the antenna element via a plurality of bump electrodes at a predetermined lengthwise portion of the slit;
- and
- a resin sealing the semiconductor chip and the plurality of bump electrodes.
Dependencies are inferred from the claim text.