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US 2006/0232364 A1Published application
Coupled resonator filters formed by micromachining
AssigneeSophia Wireless, Inc.
InventorsPhilip Koh, David Nemeth
Life of this patent
Estimating the term…
Abstract
A resonator filter assembly is provided having a first wafer (102), a second wafer (104) and a third wafer (106). A plurality of pits are etched in the first and second wafer (102, 104) and arranged such that a plurality of resonant cavities (108) are formed with a coupling cavity (110) disposed between the resonant cavities (108). By altering the dimensions of the resonant and coupling cavities (108, 110), the frequency characteristics of the filter can be adjusted as desired.
Claims39
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- at least one pit etched in said second wafer;
- and
- a transmission line which carries an input signal;
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity;
- wherein said transmission line comprises an air-filled waveguide;
- and
- wherein said resonator assembly further comprises an input structure which enables the input signal to be introduced into said at least one cavity from said transmission line.
7 more elements
(canceled)
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- at least one pit etched in said second wafer;
- a third wafer coupled to said second wafer;
- a layer of metal disposed on at least one of said first wafer, said second wafer, and said third wafer;
- and
- a transmission line which carries an input signal;
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity;
- wherein said resonator assembly further comprises an input structure which enables the input signal to be introduced from a first side of one of said first, second and third wafers into said at least one cavity from said transmission line;
- and
- wherein said transmission line is positioned on said first side.
9 more elements
(canceled)
(canceled)
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- at least one pit etched in said second wafer;
- a third wafer coupled to said second wafer;
- a layer of metal disposed on at least one of said first wafer, said second wafer, and said third wafer;
- a transmission line which carries an input signal;
- an input structure which enables the input signal to be introduced into said at least one cavity from said transmission line and which comprises an aperture formed in said layer of metal disposed on at least one of the first wafer, second wafer, and third wafer;
- and
- a plurality of via holes surrounding the aperture formed in the layer of metal;
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity.
8 more elements
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- and
- at least one pit etched in said second wafer,
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity
- wherein said at least one pit etched in said first wafer comprises a first plurality of pits,
- wherein said at least one pit etched in said second wafer comprises a second plurality of pits, and
- wherein the first plurality of pits and second plurality of pits are arranged so as to form a plurality of cavities and
- wherein the plurality of cavities comprises:
- a first resonator cavity;
- a second resonator cavity;
- and a cavity forming a coupling aperture disposed between said first resonator cavity and said second resonator cavity.
10 more elements
(canceled)
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- and
- a second wafer coupled to said first wafer;
- and
- at least one pit etched in said second wafer,
- a third wafer coupled to said second wafer;
- a layer of metal disposed on at least one of said first wafer, said second wafer, and said third wafer;
- a tuning structure that is able to adjust a frequency characteristic of the resonator assembly;
- an aperture formed in at least one of said first wafer, said second wafer, and said third wafer,
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity;
- and
- wherein said tuning structure comprises a metal cap that is provided in said aperture.
10 more elements
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- at least one pit etched in said second wafer;
- a third wafer coupled to said second wafer;
- a layer of metal disposed on at least one of said first wafer, said second wafer, and said third wafer;
- a tuning structure that is able to adjust a frequency characteristic of the resonator assembly;
- an aperture formed in said layer of metal;
- and
- a plurality of via holes that extend through at least one of said first wafer, said second wafer, and said third wafer;
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity and
- wherein the via holes are formed so as to surround said aperture formed in said layer of metal.
9 more elements
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- and
- at least one pit etched in said second wafer,
- wherein said at least one pit etched in said first wafer and said at least one pit etched in said second wafer are arranged so as to form at least one cavity and
- wherein said first wafer and said second wafer are formed of silicon.
4 more elements
A resonator assembly comprising:
- a first wafer;
- at least one pit etched in said first wafer;
- a second wafer coupled to said first wafer;
- a plurality of pits etched in said second wafer;
- a third wafer coupled to said second wafer;
- and
- at least one pit etched in said third wafer,
- wherein said plurality of pits etched in said second wafer are etched such that said second wafer forms a beam extending from at least a first end of the resonator assembly.
5 more elements
A method for convex corner protection comprising:
- providing a wafer having a first etch masking layer on a first side of said wafer and a second side of said wafer, wherein the second side is disposed opposite to the first side;
- patterning a first pit and a second pit on the first side of the wafer;
- etching the wafer so as to form the first pit and the second pit in said wafer;
- providing a second etch masking layer on the first side of the wafer such that an inside of the first and second etched pits are covered by the second etch masking layer;
- patterning the wafer on the second side of said wafer such that the second masking layer is disposed only in an area between the first and second etched pits;
- and
- etching the second side of said wafer so as to remove the portion of the wafer not covered by the second masking layer.
4 more elements
Dependencies are inferred from the claim text.