Semiconductor integrated circuit and method for testing connection state between semiconductor integrated circuits
OwnerKazutoshi Shimizume, Hiroaki Mizogutiinventors
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Abstract
A semiconductor integrated circuit including an input terminal and an input circuit connected to the input terminal includes the following elements. A testing circuit is provided between the input terminal and the input circuit, and changes a resistance value between the input terminal and a predetermined potential. A test terminal is adapted to operate the testing circuit.
Claims9
A semiconductor integrated circuit including an input terminal and an input circuit connected to the input terminal, the semiconductor integrated circuit comprising:
- a testing circuit that is provided between the input terminal and the input circuit and that changes a resistance value between the input terminal and a predetermined potential;
- and
- a test terminal adapted to operate the testing circuit.
A semiconductor integrated circuit including a plurality of input terminals and a plurality of input circuits correspondingly connected to the plurality of input terminals, the semiconductor integrated circuit comprising:
- a plurality of testing circuits that are provided between the input terminals and the input circuits and that change resistance values between the input terminals and a predetermined potential;
- and
- a common test terminal adapted to operate the plurality of testing circuits.
A method for testing a connection state between an output terminal of a first semiconductor integrated circuit and an input terminal of a second semiconductor integrated circuit, the method comprising the steps of:
- controlling the first semiconductor integrated circuit to output a voltage of a predetermined level from the output terminal;
- controlling a testing circuit that is provided in the second semiconductor integrated circuit and that changes a resistance value between the input terminal and a predetermined potential to change a voltage of the input terminal;
- comparing the voltage of the input terminal and a predetermined threshold in the second semiconductor integrated circuit;
- and
- testing the connection state according to a result of the step of comparing.
A system-in-package in which a first semiconductor integrated circuit and a second semiconductor integrated circuit are connected using a bump, the system-in-package comprising:
- a plurality of input terminals;
- input circuits correspondingly connected to the input terminals;
- a plurality of testing circuits that are provided between the input terminals and the input circuits and that change resistance values between the input terminals and a predetermined potential;
- and
- a common test terminal adapted to operate the plurality of testing circuits.
Dependencies are inferred from the claim text.