Back to results
US 2006/0232291 A1Published application
Carrier unit for a semiconductor device and semiconductor socket using the same
AssigneeYamaichi Electronics Co., Ltd.
InventorsYoshinori Wakabayashi, Minoru Hisaishi, Takeyuki Suzuki, Noriyuki Matsuoka
Life of this patent
Estimating the term…
Abstract
In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.
Claims9
A carrier unit for a semiconductor device comprising:
- an electrode sheet having a bump-forming surface on which are formed bumps to be electrically connected to terminals of a semiconductor device;
- a posture-stabilizing member disposed on said bump-forming surface of said electrode sheet, having an opening through which pass the terminals of said semiconductor device and said bumps, said member for stabilizing a posture of a connecting surface of said semiconductor device, on which the terminals of said semiconductor device are formed, to be generally parallel to said bump-forming surface of said electrode sheet;
- and
- a housing member having an accommodating portion for accommodating said electrode sheet and said posture-stabilizing member.
1 more element
Dependencies are inferred from the claim text.