Flat image display device
OwnerAkiyoshi Yamada, Hiromitsu Takeda +2inventors
InventorsAkiyoshi Yamada, Hiromitsu Takeda, Hirotaka Unno, Yuichi Shinba
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Abstract
A flat image display device includes two glass substrates located opposite each other with a gap therebetween and a seal portion which seals a predetermined position on the glass substrates and defines a sealed space between the two glass substrates. The seal portion having a low-melting-point metal filled along the predetermined position and a metal layer provided between respective surfaces of the glass substrates and low-melting-point metal and formed of a metal which has connectivity to glass, affinity to the low-melting-point metal, and a solubility of less than 1% to the low-melting-point metal to be melted at a temperature of 500° C. or less.
Claims11
A flat image display device comprising:
- two glass substrates located opposite each other with a gap therebetween and a seal portion which seals a predetermined position on the glass substrates and defines a sealed space between the two glass substrates,
- the seal portion having a low-melting-point metal filled along the predetermined position and a metal layer provided between respective surfaces of the glass substrates and low-melting-point metal and formed of a metal which has connectivity to glass, affinity to the low-melting-point metal, and a solubility of less than 1% to the low-melting-point metal to be melted at a temperature of 500° C. or less.
A flat image display device comprising:
- two glass substrates located opposite each other with a gap therebetween and a seal portion which seals a predetermined position on the glass substrates and defines a sealed space between the two glass substrates,
- the seal portion having a low-melting-point metal filled along the predetermined position, a metal layer provided between respective surfaces of the glass substrates and the low-melting-point metal and formed of a metal which has connectivity to glass, affinity to the low-melting-point metal, and a solubility of less than 1% to the low-melting-point metal to be melted at a temperature of 500° C. or less, and a protective layer provided between the metal layer and the low-melting-point metal and having affinity to the low-melting-point metal.
Dependencies are inferred from the claim text.