Piezoelectric diaphragm assembly with conductors on flexible film

A method of making a laminated piezoelectric composite, the laminated piezoelectric composite comprising at least a substrate and a piezoelectric wafer, the method comprising:

• forming a first conductive lead on a first adhesive carrier layer;
• inserting the first adhesive carrier layer between a first surface of the piezoelectric wafer and the substrate;
• using the first adhesive carrier layer to adhere the first surface of the piezoelectric wafer to the substrate and to carry the first conductive lead for supplying an electrical signal or voltage to the first surface of the piezoelectric wafer;
• and
• connecting a second conductive lead to a second surface of the piezoelectric wafer.

A laminated piezoelectric composite comprising:

• a metallic substrate;
• a piezoelectric wafer having a first surface and a second surface;
• a first adhesive carrier layer between the first surface of the piezoelectric wafer and the substrate, the first adhesive carrier layer serving both to adhere the first surface of the piezoelectric wafer to the substrate and to carry a first conductive lead for supplying an electrical signal or voltage to the first surface of the piezoelectric wafer;
• a second adhesive carrier layer adhered to the second surface of the piezoelectric wafer and carrying a second conductive lead for supplying an electrical signal or voltage to the second surface of the piezoelectric wafer;
• wherein each of the first adhesive carrier layer and the second adhesive carrier layer have an appendage which extends in an extension direction beyond a footprint of the substrate, and wherein the appendage of the first adhesive carrier layer and the appendage of the second adhesive carrier layer form a fused multilayer conductor carrier, and wherein in a thickness direction of the fused multilayer conductor carrier the first conductive lead does not overlap the second conductive lead.