Viscosity reducible radiation curable resin composition
OwnerXiaorong Youinventor
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Abstract
The invention relates to a viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties i) a yield stress value of <1100 Pa, ii) a viscosity (at a shear rate of 1 sec−1) between 1 and 1500 Pa·sec, and iii) a filler settling speed less than 0.3 mm/day.
Claims18
A viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties:
- i) a yield stress value of <1100 Pa,
- ii) a viscosity (at a shear rate of 1 sec−1) between 1 and 1500 Pa·sec, and
- iii) a filler settling speed less than 0.3 mm/day.
A viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties:
- i) a yield stress value of <1100 Pa,
- ii) a viscosity (at a shear rate of 10 sec−1) between 1 and 200 Pa·sec, and
- iii) a filler settling speed less than 0.3 mm/day.
A viscosity reducible radiation curable composition comprising
- 5-70 wt % of a difunctional epoxy compound
- 0.1-15 wt % of an acrylate having a functionality of larger than 2
- 0.1-10 wt % of a thixotropic agent
- 0.01-5 wt % of a flow modifier
- 10-90 wt % of a filler and at least one photoinitiator
Dependencies are inferred from the claim text.