Non-cavity semiconductor packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChao-Yuan Su, Pei-Haw Tsao, Chender Huang
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Abstract
Non-cavity semiconductor packages. One embodiment of the packages includes a non-cavity substrate, a first die, an encapsulant, and a second die. The non-cavity substrate comprises a first surface and an opposite second surface. The first surface comprises an external terminal thereon. The first die is attached and wire-bonded to the first surface of the substrate. The encapsulant covers the first die. The second die electrically connects to the second surface of the substrate. The second die is larger than the first die.
Claims22
A non-cavity semiconductor package, comprising:
- a non-cavity substrate comprising a first surface and an opposite second surface, the first surface comprising an external terminal thereon;
- a first die attached and wire-bonded to the first surface of the substrate;
- an encapsulant covering the first die;
- and
- a second die, larger than the first die, electrically connecting to the second surface of the substrate.
A non-cavity semiconductor package, comprising:
- a non-cavity substrate comprising a first surface and an opposite second surface, the first surface comprising an external terminal thereon;
- a first die attached and wire-bonded to the first surface of the substrate;
- an encapsulant covering the first die;
- a conductive bump protruding from and electrically connecting to the second surface of the substrate;
- a second die, larger than the first die, comprising an active surface electrically connecting to the conductive bump;
- and
- an underfill disposed between the second die and the second surface of the substrate, encapsulating the conductive bump.
A non-cavity semiconductor package, comprising:
- a non-cavity substrate comprising a first surface and an opposite second surface, the first surface comprising an external terminal thereon;
- a first die attached and wire-bonded to the first surface of the substrate;
- a first encapsulant covering the first die;
- a conductive bump protruding from and electrically connecting to the second surface of the substrate;
- a second die, larger than the first die, comprising an active surface electrically connecting to the conductive bump;
- an underfill disposed between the second die and the second surface of the substrate, encapsulating the conductive bump;
- and
- a second encapsulant covering the second die and underfill.
Dependencies are inferred from the claim text.