Bonding pad for a packaged integrated circuit
OwnerFuaida Harun, Liang Koh +1inventors
InventorsFuaida Harun, Liang Koh, Lan Tan
Life of this patent
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Abstract
An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.
Claims13
1-18. (canceled)
A package substrate for an integrated circuit, comprising:
- a top traceless surface;
- a bottom traceless surface;
- a plurality of vias in the package substrate extending between the top and bottom traceless surfaces;
- a plurality of via capture pads arranged on the top traceless surface, wherein each of the via capture pads surrounds a respective one of the vias and each via capture pad includes:
- a land area;
- a clearance area surrounding the land area;
- and
- a photo mask surrounding the clearance area;
- and
- wherein each via capture pad includes at least one sharp edge that assists a pattern recognition system of a wire bonder in locating at least one bond wire on the via capture pad.
(canceled)
(canceled)
Dependencies are inferred from the claim text.