Fan out type wafer level package structure and method of the same

A fan out type package structure, comprising:

• a metal alloy base, wherein material of said metal alloy base comprises Fe—Ni alloy, Fe—Ni—Co alloy, Cu—Fe alloy, Cu—Cr alloy, Cu—Ni—Si alloy, Cu—Sn alloy or Fe—Ni alloy with fiber glass material laminated;
• a die adhered to said metal alloy base;
• a first dielectric layer formed on said metal alloy base and filled in a space except said die on said metal alloy base;
• a second dielectric layer formed on said first dielectric layer and said die, and said second dielectric layer having first openings on first pads of said die;
• a first contact conductive layer formed on said first openings to electrically coupling with said first pads, respectively;
• a first conductive lines formed on said second dielectric layer and corresponding said first contact conductive layer, and said first conductive lines being extended out from corresponding said first contact conductive layer to corresponding first end points, wherein said corresponding first end points are inside a surface of said second dielectric layer;
• a first isolation layer formed on said first conductive lines and said second dielectric layer, and said first isolation layer having second openings on said first conductive lines;
• and
• UBM (under ball metallurgy) and/or solder balls welded on said second openings and electrical coupling with said first conductive lines, respectively.