BGA semiconductor chip package and mounting structure thereof

A mounting structure of a BGA semiconductor chip package, the mounting structure comprising:

• a BGA semiconductor chip package including:
• a substrate having first and second surfaces;
• a semiconductor chip mounted on the first surface of the substrate, and having a plurality of bonding pads on a side not mounted to the substrate;
• and
• plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate;
• and
• a mounting substrate including connection pads and one or more protective layers, wherein the I/O solder balls are connected to the connection pads and the dummy solder balls are connected to the one or more protective layers, and wherein a height of the one or more protective layers is higher than a height of the connection pads.

A mounting structure of a BGA semiconductor chip package, the mounting structure comprising:

• a BGA semiconductor chip package including:
• a substrate having first surface, second surface, and a window therein;
• a semiconductor chip mounted on the first surface of the substrate, and having a plurality of bonding pads provided within the window;
• and
• plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate;
• and
• a mounting substrate including connection pads and one or more protective layers, wherein the I/O solder balls are connected to the connection pads and the dummy solder balls are connected to the one or more protective layers, and wherein a height of the one or more protective layers is higher than a height of the connection pads.