Electronic devices including offset conductive bumps
AssigneeUnitive International Limited
InventorsJong-Rong Jan, Tsai-Hua Lu, Sao-Ling Chiu, Ling-Chen Kung
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Abstract
Bumping a substrate having a metal layer thereon may include forming a barrier layer on the substrate including the metal layer and forming a conductive bump on the barrier layer. Moreover, the barrier layer may be between the conductive bump and the substrate, and the conductive bump may be laterally offset from the metal layer. After forming the conductive bump, the barrier layer may be removed from the metal layer thereby exposing the metal layer while maintaining a portion of the barrier layer between the conductive bump and the substrate. Related structures are also discussed.
Claims13
An electronic device comprising:
- a substrate including an exposed metal layer thereon;
- a barrier layer on the substrate offset from the exposed metal layer;
- and
- a conductive bump on the barrier layer wherein the barrier layer is between the conductive bump and the substrate, wherein the conductive bump is offset from the metal layer, and wherein the barrier layer, the conductive bump, and the metal layer all comprise different conductive materials.
An integrated circuit device comprising:
- an integrated circuit substrate;
- an exposed metal layer on the integrated circuit substrate;
- a barrier layer on the integrated circuit substrate laterally offset from the exposed metal layer;
- and
- a conductive bump on the barrier layer wherein the barrier layer is between the conductive bump and the substrate and wherein the conductive bump is remote from the metal layer.
Dependencies are inferred from the claim text.