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US 2006/0231950 A1Published application
Semiconductor package accomplishing fan-out structure through wire bonding
AssigneeSamsung Electronics Co., Ltd.
InventorTae-Sung YOON
Life of this patent
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Abstract
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented.
Claims27
A semiconductor comprising
- a semiconductor chip having a first surface and a second surface the first surface including a plurality of first solder ball pads and a plurality of first bond fingers;
- and
- a printed circuit board having a first surface and a second surface, the first surface including a plurality of second solder ball pads, a plurality of second bond fingers, and a chip recess to receive therein the semiconductor chip, the first bond fingers and the second bond fingers being electrically connectable.
A semiconductor package comprising:
- a semiconductor chip having on a first surface thereof a plurality of first solder ball pads and a plurality of first bond fingers;
- a multi-layered printed circuit board having on a first surface thereof a plurality of second bond fingers and a plurality of second solder ball pads, having a chip recess to receive therein the semiconductor chip, the plurality of second bond fingers and the plurality of second solder ball pads being distributed about portions of the periphery of the chip recess, the plurality of first bond pads and the plurality of second bond pads being positionable in relation to one another when the semiconductor chip is located in the chip recess, and having on a second surface thereof a plurality of third solder ball pads;
- a plurality of wires to connect the first bond fingers and the second bond fingers;
- an encapsulant to seal the plurality of wires;
- and
- a plurality of solder balls attachable to the first plurality of solder balls and to the plurality of second solder ball pads.
3 more elements
Dependencies are inferred from the claim text.