Thermally enhanced semiconductor package and fabrication method thereof

A fabrication method of a thermally enhanced semiconductor package, comprising the steps of:

• mounting and electrically connecting at least one semiconductor chip to an upper surface of a chip carrier on which a receiving plate having an opening corresponding in position to the semiconductor chip is mounted, wherein the semiconductor chip is received in the opening and mounted on the chip carrier;
• attaching a heat sink via a bottom surface thereof to the semiconductor chip, with an interface layer being formed on a top surface of the heat sink;
• performing a molding process to form an encapsulate for encapsulating the heat sink, the semiconductor chip and a portion of the receiving plate;
• performing a cutting process along edges of the opening of the receiving plate to remove the receiving plate and a portion of the encapsulate formed on the receiving plate;
• and
• removing a portion of the encapsulant formed on the interface layer on the heat sink.