Pillar grid array package
AssigneesChipMOS Technologies (Bermuda) Ltd., ChipMOS Technologies Inc.
InventorsHsiang-Ming Huang, Yeong-Ching Chao, Yi-Chang Lee, An-Hong Liu
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Abstract
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, by an anisotropic conductive paste to achieve a thin package and to avoid substrate warpage problems of a ball grid array (BGA) during high-temperature reflow processes.
Claims17
A pillar grid array package comprising:
- a substrate having a top surface and a bottom surface;
- a chip disposed on the top surface of the substrate;
- and
- a plurality of stud bumps formed by wire-bonding and disposed on the bottom surface of the substrate in an array, wherein each stud bump has a flattened top exposed.
An electronic device comprising:
- a PCB (printed circuit board);
- and
- a PGA (Pillar Grid Array) package mounted on the PCB, the package comprising:
- a substrate having a top surface and a bottom surface;
- a chip disposed on the top surface of the substrate;
- and
- a plurality of stud bumps formed by wiring-bonding and disposed on the bottom surface of the substrate in an array wherein each stud bump has a flattened top and electrically connecting the PCB.
A pillar grid array package comprising:
- a substrate having a top surface and a bottom surface;
- a chip disposed on the top surface of the substrate;
- and
- a plurality of pillar bumps disposed on the bottom surface of the substrate in an array wherein each pillar bump has a flattened top exposed.
Dependencies are inferred from the claim text.