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US 2006/0231940 A1Published application
High density direct connect LOC assembly
OwnerTrung Doaninventor
Life of this patent
Estimating the term…
Abstract
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in a LOC arrangement. Alternately, a connector may contact a portion of the conductive trace to make contact therewith.
Claims4
An assembly comprising:
- a semiconductor die having a periphery and an active surface having a plurality of electric contact points disposed on the active surface;
- and
- a plurality of conductive traces on the active surface, each conductive trace of the plurality of conductive traces comprising a first end electrically contacting at least one electric contact point of the plurality of electric contact points and a second end terminating proximate the semiconductor die periphery, each conductive trace comprising a trace of extruded conductive material on the active surface between the at least one semiconductor die electric contact point making contact therewith and the periphery of the semiconductor die.
A plurality of semiconductor dice on a wafer, comprising:
- a plurality of semiconductor dice located on the wafer, each semiconductor die having a periphery and an active surface with at least one electric contact point disposed on the active surface;
- and
- at least one conductive trace on the active surface, the at least one conductive trace comprising a first end electrically contacting the at least one semiconductor die electric contact point and a second end terminating proximate the semiconductor die periphery, the at least one conductive trace comprising a trace of extruded conductive material on the active surface between the at least one electric contact point making contact therewith and the periphery of the semiconductor die to expose a portion of the at least one conductive trace at a portion of the periphery of the semiconductor die.
Dependencies are inferred from the claim text.