US 2006/0231937 A1 · Thin multiple semiconductor die package

Abstract

A method and apparatus for forming a multiple semiconductor die assembly (200, 300, 400) having a thin profile are presented. The semiconductor die assembly (200, 300, 400) comprises a plurality of die packages (100), with each die package (100) including a lead frame (10) having a plurality of leads (11) each having a down set portion (101) extending from a first surface (14). A semiconductor die (30) is disposed in a central region (12) of the lead frame (10) and is electrically connected to the leads (11). An encapsulant (50) is disposed in the central region (12) and covers to the semiconductor die (30) and a portion of the leads (11). The first surface (14) of the leads (11) and a first surface (34) of the semiconductor die (30) are substantially coplanar and are exposed from the encapsulant (50). The first surface (34) of the semiconductor die (30) and the down set portions (101) of the leads form a cavity (102). The semiconductor die packages (200, 300, 400) are stacked such that at least a portion of the encapsulant (50) is disposed in the cavity of a next higher semiconductor die package (200, 300, 400) in the stack.

Claims18

Dependent claims

A semiconductor die assembly (200, 300, 400), comprising:

a plurality of die packages (100), each including:
a lead frame (10) having a plurality of leads (11) surrounding a central region (12), each of the leads (11) having a first surface (14) and a down set portion (101) extending from the first surface (14),
a semiconductor die (30) disposed in the central region (12) and electrically connected to the leads (11), the semiconductor die (30) having a first surface (34) formed thereon, the first surface (34) of the semiconductor die (30) being substantially coplanar with the first surface (14) formed on each of the leads (11), and
an encapsulant (50) disposed in the central region (12) and covering the semiconductor die (30) and a portion of the leads (11), the first surface (14) of the leads (11) and the first surface (34) of the semiconductor die (30) being exposed from the encapsulant (50), and the first surface (34) of the semiconductor die (30) and the down set portions (101) of the leads (11) forming a cavity (102);
wherein the plurality of die packages (100) are stacked such that at least a portion of the encapsulant (50) is disposed in the cavity (102) of a next higher die package (100) in the stack.

2 more elements

A method for forming a semiconductor die assembly (200, 300, 400), the method comprising:

forming a plurality of individual semiconductor die packages (100), including:
providing a lead frame (10) having a plurality of leads (11) surrounding a central region (12), each of the leads (11) including a first surface (14) formed thereon,
disposing a semiconductor die (30) in the central region (12), the semiconductor die (30) having a first surface (34) formed thereon, the first surface (34) of the semiconductor die (30) being substantially coplanar with the first surface (14) formed on each of the leads (11),
electrically connecting the semiconductor die (30) to the leads (11),
covering a portion of the semiconductor die (30) and a portion of the leads (11) with an encapsulant (50), and
shaping each of the leads (11) to include a first surface (14) and a down set portion (101) extending from the first surface (14), the first surface (14) of the leads and the first surface (34) of the semiconductor die (30) being exposed from the encapsulant (50), and the first surface (34) of the semiconductor die (30) and the down set portions (101) of the leads (11) forming a cavity (102);
stacking the plurality of individual semiconductor die packages (100) such that at least a portion of the encapsulant (50) is disposed in the cavity (102) of a next higher semiconductor die package (100) in the stack;
and
electrically interconnecting corresponding leads (11) of the stacked semiconductor die packages (100).

6 more elements

Dependencies are inferred from the claim text.

Thin multiple semiconductor die package

Life of this patent

Thin multiple semiconductor die package

Life of this patent

Abstract

Claims18