BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same
AssigneeNEC Electronics Corporation
InventorKoji Nishida
Life of this patent
Estimating the term…
Abstract
In a semiconductor package including a wiring board having a top surface, a bottom surface and a side face. The bottom surface is divided into a central area, and a peripheral area surrounding the central area. A semiconductor chip is mounted on the top surface of the wiring board so as to be electrically connected to a wiring pattern layer of the wiring board. An array of metal balls is provided as electrode terminals in the central area on the bottom surface of the wiring board. A plurality of additional electrode terminals are provided in the peripheral area on the bottom surface and/or the side face of the wiring board.
Claims18
A semiconductor package comprising:
- a wiring board having a top surface, a bottom surface and a side face, said bottom surface being divided into a central area, and a peripheral area surrounding said central area;
- a semiconductor chip mounted on the top surface of said wiring board so as to be electrically connected to a wiring pattern layer of said wiring board;
- an array of metal balls provided as electrode terminals in the central area on the bottom surface of said wiring board;
- and
- a plurality of additional electrode terminals provided in the peripheral area on the bottom surface and/or the side face of said wiring board.
A method for manufacturing a semiconductor package, comprising:
- preparing a wiring board substrate on which a wiring board area is defined, said wiring board substrate having a wiring pattern layer provided at said wiring board area, and an array of electrode pads formed in a central area on a bottom surface of said wiring board area;
- mounting a semiconductor chip on a top surface of said wiring board substrate at the wiring board area;
- forming a plurality of openings in said wiring board substrate along boundaries defining said wiring board area;
- at least partially stuffing said openings with an electrical conductive material;
- and
- cutting said wiring board substrate along said boundaries defining said wiring board area.
Dependencies are inferred from the claim text.