Semiconductor device
AssigneeSeiko Instruments Inc.
InventorTomomitsu Risaki
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Abstract
Decrease in parasitic resistance caused by paste for adhering a semiconductor device to a lead frame or by a semiconductor substrate is disclosed. In a semiconductor device having a semiconductor substrate with an electrode formed on a rear surface thereof, an uneven structure is formed on the rear surface of the semiconductor substrate, and the rear surface electrode is formed and is adhered to a lead frame, thereby decreasing parasitic resistance and improving driving capability.
Claims13
A semiconductor device, comprising:
- a semiconductor chip;
- a rear surface of the semiconductor chip comprising an uneven structure having a concave and a convex;
- and
- the rear surface electrode disposed along the uneven structure.
A semiconductor device, comprising a semiconductor chip having a rear surface electrode provided on a rear surface thereof, wherein a lower surface of the rear surface electrode comprises an uneven structure having a concave and a convex.
A semiconductor device comprising:
- a semiconductor chip having a rear surface electrode provided on a rear surface thereof;
- a lead frame contacting with the rear surface electrode;
- and
- a surface of the lead frame comprising an uneven structure having a concave and a convex.
Dependencies are inferred from the claim text.