Lead frame for semiconductor package

Abstract

A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufacturing the lead frame are provided. The lead frame includes a base metal layer formed of a metal and a plurality of plating layers having different components formed on at least a surface of the base metal layer, wherein the plating layers include, a Ni plating layer deposited on at least a surface of the base metal layer and formed of Ni or an Ni alloy, a Pd plating layer stacked on at least a surface of the Ni plating layer and formed of Pd or a Pd alloy, and a protection plating layer stacked on at least a surface of the Pd plating layer and formed of Au or an Au alloy, wherein the Ni plating layer is formed to have a predetermined a thickness and a surface coarseness.

Dependencies are inferred from the claim text.