Semiconductor chip mounting body and manufacturing method thereof
AssigneeKumamoto Technology & Industry Foundation
InventorYasuhide Ohno
Life of this patent
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Abstract
A semiconductor chip (20) including a protruding electrode (bump) (23) in an external extraction electrode is mounted on a wiring board (10), and a semiconductor chip (30) is mounted on the semiconductor chip (20). Electrical connections between a wiring layer (12) of the wiring board (10) and the protruding electrode (23) of the semiconductor chip (20) and between the protruding electrodes of the semiconductor chips (20) and (30) are established by electrolytic plating. Stable connections between the wiring layer (12) and the protruding electrode (23) and between the protruding electrodes of the semiconductor chips (20) and (30) are established by plating films (24) and (33).
Claims13
A semiconductor chip package, comprising:
- a wiring board including a wiring layer on a surface;
- a first semiconductor chip including a protruding electrode and being mounted on the wiring board, the first semiconductor chip in which the protruding electrode is in contact with the wiring layer, and at least an area around a contact portion between the protruding electrode and the wiring layer is covered with a conductive plating film;
- and
- one or two or more second semiconductor chips each including a protruding electrode and being mounted on the first semiconductor chip, the second semiconductor chips in which at least an area around a contact portion between protruding electrodes is covered with a conductive plating film.
A method of manufacturing a semiconductor chip package, comprising the steps of:
- aligning a first semiconductor chip including a protruding electrode with a wiring board including a wiring layer on a surface so that the protruding electrode is in contact with a predetermined connecting point on the wiring layer of the wiring board, and aligning one or two or more second semiconductor chips each including an protruding electrode with the first semiconductor chip so that the protruding electrodes are in contact with one another;
- and
- establishing electrical connections between the protruding electrode of the first semiconductor chip and a connecting point of the wiring layer of the wiring board and between the protruding electrodes of the first semiconductor chip and the second semiconductor chips by a plating film.
A method of manufacturing a semiconductor chip package according to claim, wherein
- the plating film is formed while supersonic vibration is applied to a wall surface of a plating bath.
A method of manufacturing a semiconductor chip package according to claim, wherein
- after a wiring board on which the first semiconductor chip and the second semiconductor chips are mounted is placed in a plating bath, and a pressure in the plating bath is reduced, a plating solution is contained in the plating bath.
A method of manufacturing a semiconductor chip package according to claim, wherein
- the plating film is formed while applying a pressure to a plating solution contained in a plating bath.
Dependencies are inferred from the claim text.