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AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMarkus Wuchse, Nikolai Haslebner, Ronald Frosch, Manfred Riedler, Guenther Leising
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A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with an upper top electrode (9); the substrate (2) is comprised of a printed circuit board (2) known per se and including an insulation-material base body (3) and a metal coating as the conductor layer (5), wherein the conductor layer (5) forms the base electrode (4) and, to this end, is smoothed at least on the location of the thin-film component (8), and wherein a contact layer (18) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer (5) and the superimposed thin-film layers (21) of the thin-film component (8), which contact layer is physically or chemically adsorbed on the surface of the base electrode (4).
A thin-film assembly including a substrate and at least one electronic thin-film component applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with an upper top electrode (9), characterized in that the substrate is comprised of a printed circuit board (2) including an insulation-material base body (3) and a metal coating as the conductor layer (5), that the conductor layer (5) forms the base electrode (4) and, to this end, is smoothed at least on the location of the thin-film component, and that a contact layer (18) in thin film technology is provided between the smoothed, optionally reinforced, conductor layer (5) and the superimposed thin-film layers (21) of the thin-film component, which contact layer is physically or chemically adsorbed on the surface of the base electrode (4).
A method for producing a thin-film assembly including at least one electronic thin-film component which is applied on a substrate by thin-film technology, characterized in that a printed circuit board with an insulation-material base body and a metal coating as the conductor layer is used, that the conductor layer is at least locally smoothed, optionally upon attachment of a reinforcement, in order to form at least one base electrode for the thin-film component, and that a contact layer is applied on the base electrode by thin-film technology prior to attaching the remaining thin-film component thereabove.
Dependencies are inferred from the claim text.