Bonding strength testing device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChang-Lin Yeh, Yi-Shao Lai
Life of this patent
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Abstract
A bonding strength test device suits to perform a bonding strength test for at least one solder ball that fixed on a substrate. The bonding strength test device includes a fixed base and an impact apparatus. The impact apparatus has a first end and a second end corresponding to the first end. While an impact is applied to the first end of the impact apparatus, the impact apparatus moves downward, and the second end of the impact apparatus hits the solder ball on the substrate for performing the bonding strength test. Besides, the fixed base is used for limiting the downward movement of the impact apparatus.
Claims14
A bonding strength testing device suitable for performing a bonding strength test on at least a solder ball fixed onto a substrate, the bonding strength testing device comprising:
- a fixed base having a through hole;
- an impact apparatus being able to slide through the through hole, wherein the impact apparatus has a first end and a second end relative to the first end, and the first end of the impact apparatus is suitable for receiving an external force so that the impact apparatus can apply an impact force on the solder ball for carrying out the bonding strength test through the second end;
- and
- a stress sensor disposed in the impact apparatus for measuring the stress applied to the impact apparatus.
A bonding strength testing device suitable for performing a bonding strength test on at least a solder ball fixed onto a substrate, the bonding strength testing device comprising:
- an impact apparatus having a first end and a second end relative to the first end, while an impact is applied to the first end of the impact apparatus, the impact apparatus moves downward, and the second end of the impact apparatus hits the solder ball on the substrate for performing the bonding strength test;
- and
- a fixed base used for limiting the downward movement of the impact apparatus.
Dependencies are inferred from the claim text.