Image sensor module package

Abstract

An image sensor module package is disclosed. A plurality of connecting pads are formed on a first surface of a glass substrate having and located outside a light entering area. A via-redistribution layer is formed on an opposing second surface of the glass substrate. A plurality of vias penetrate the glass substrate to electrically connect the via-redistribution layer with the connecting pads. A bumped image sensor chip is flip-chip attached to the second surface of the glass substrate so that a sensing area of the image sensor chip is corresponding to a light entering area of the glass substrate without blocking the via-redistribution layer. The connecting pads may connect to a plurality of solder balls or a FPC. In one embodiment, a plurality of passive components can be placed on the via-redistribution layer to enhance the electrical performance and the functions of the image sensor module package.

Dependencies are inferred from the claim text.