Method and structure for implementing secure multichip modules for encryption applications

A secure cap structure for an integrated circuit (IC) module, comprising:

• a metallized, ceramic top portion;
• and
• a footing integrated with said top portion, said footing configured to be attached to a chip carrier of the IC module in a manner so as to surround one or more IC chips attached to the chip carrier when the cap structure is attached to the chip carrier.

A method for implementing a tamper resistant, integrated circuit (IC) module, the IC module including a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a ceramic-based cap structure attached to the chip carrier, the method comprising:

• forming a conductive grid structure within in the chip carrier and the cap structure, said conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction;
• wherein said conductive grid structure is configured to determine an attempt to penetrate the IC module by detecting at least one of a change in resistance and a change in capacitance of said conductive grid structure.