Ultrasonic tool and ultrasonic bonder
AssigneeFujitsu Limited
InventorsShuichi Takeuchi, Hidehiko Kira, Yukio Ozaki
Life of this patent
Estimating the term…
Abstract
An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.
Claims4
An ultrasonic tool to bond first and second materials together at an interface of respective and contacting, opposing first surfaces thereof, comprising:
- a contact surface of the ultrasonic tool engagable with a second surface, opposite the first surface, of a selected one of the first and second materials, to apply ultrasonic waves through the selected one of the first and second materials to the interface of the respective and contacting, opposing first surfaces of the first and second materials;
- and
- a coating layer comprising chromium covering the contact surface of the ultrasonic tool.
Dependencies are inferred from the claim text.