Heater that attaches electronic component to and detaches the same from substrate
AssigneeFujitsu Limited
InventorsRie Takada, Kenichiro Tsubone
Life of this patent
Estimating the term…
Abstract
A heater that attaches an electronic component having a ball grid array structure to and detaches the electronic component from a substrate on which the electronic component operates includes a body fixed onto the electronic component, and a heating element, provided on the body, which heats and melts soldering balls having the ball grid array structure when receiving power supply.
Claims16
A heater that attaches an electronic component having a ball grid array structure to and detaches the electronic component from a substrate on which the electronic component operates, said heater comprising:
- a body fixed onto the electronic component;
- and
- a heating element, provided on said body, which heats and melts soldering balls having the ball grid array structure when receiving power supply.
A method for manufacturing a substrate that can mount an electronic component having a ball grid array structure, said method comprising the steps of:
- forming a footprint connected to an electronic component, on a body that can mount the electronic component;
- and
- forming a heating element around the footprints, which melts soldering balls having the ball grid array.
Dependencies are inferred from the claim text.